Products – STIGP

Hexa EVO & EVO+ Integrated Tray-based Scan Pack
Hexa Evo / Evo+
2D/3D High Speed Scanner for Large Form Factor Packages The Hexa is the latest addition to the highly successful Integra Hexa family. It provides the most comprehensive quality assurance solution for detection of backend process induced defects for all ball array, peripheral leaded/leadless and large form factor packages. The highly modular design concept allows flexibility for various options like – Dual taper, auxiliary tray input, top and bottom surface inspection, side surface inspection etc. Simple and repeatable conversions also make the Hexa Evo perfectly suited for customers with high mix, small lot size production environment. STI’s proprietary vision solution encompasses pioneering technology in areas such as optics design, lighting control, and software algorithm. Coupled with advanced automation features, the Hexa Evo offers a diverse menu of inspection and output options configurable to match all package requirements.

Top Package Visual Inspect (PVI) with orientation checking and correction

Bottom PVI

3D On-The-Fly Lead / Ball Inspection

Symbol Inspection

In-pocket Inspection

Dual Tape & Reel

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iFocus Wafer Inspection Machine

iFocus
STI’s iFocus is a highly intelligent precision wafer inspection system that offers a comprehensive solution for the inspection of frame and/or whole wafer. Using STI’s proprietary On-The-Fly (OTF™) vision, the iFocus can be configured to detect any type of micro defects arising from wafer processing, post dicing or packing. The OTF™ optical system encompasses pioneering technology in areas such as optics and illumination design, 2D, 3D and active die inspection algorithms. Patented Simultaneous Dual Illumination Image Capture Technology is used to eliminate escape and reduce overkill without compromising throughput.
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tSort Wafer Level Die Sorter

tSort
intelligent, intuitive and high speed die sorting tSort is a cost effective solution developed for high speed die sorting into tape and reel. Process knowledge from our widely acclaimed range of taping machines and vision engines was incorporated into its design – distinguishing it in a class of its own. Using STI’s proprietary iVISION technology, tSort provides a state of the art vision algorithm for inspecting wafer level chip scale packages with unsurpassed accuracy and reliability. Aided with an intelligent vision-guided pick and place transfer, it ensures only devices that meet stipulated quality are placed into the output reels, ready for the next process step. tSort utilized cutting edge technologies in robotic motion control and as such comes packaged with a user friendly interface, providing a truly robust solution for today’s demanding production environment. iSORT Express utilizes cutting edge technologies in robotic motion control and as such comes packaged with a user friendly interface, providing a truly robust solution for today’s demanding production environment.

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AT468 Turret-based Scan Pack

AT468 – Multi-station Handler for Leadless Packages AT468 is a high speed multi-function scan-pack handler engineered for Lead and Leadless packages. This fully automated design consists of a primary 24- station rotary turret coupled with a secondary multi-station inspection table. The modular concept allows for media transfer flexibility, supporting a wide range of I/O configurations. These include plastic tube, multi-channel metal magazine, vibratory bowl, Jedec tray and reel. Single or multiple test stations can also be integrated into the AT468. STI’s proprietary vision technologies are employed to provide ONE Vision Solution for all package types. This architecture provides our customers with a powerful one-stop strategy, facilitating standardisation of quality assurance inspection techniques.
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TR48MK5 High Speed Tray Taping Machine

TR48MK5 - Tape & Reel System with 2D Inspection
The TR48MK5, a high speed Tray Taping System with unique triple head pick and place design, combines high performance with ease of operation. The system designed provides a 2D in-pocket vision inspection solution for lead and mark with an autosort reject management capability.
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