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Wafer-Level Chip Scale Packaging Inspection & Sort
Integrated Tray-based Mark-Scan-Pack
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Integrated Tray-based Mark-Scan-Pack
Integra "Hexa"
Top Package Visual Inspect (PVI) with orientation checking and correction
Bottom PVI
3D On-The-Fly Lead / Ball Inspection
Symbol Inspection
In-pocket Inspection
Dual Tape & Reel
     
The Integra "Hexa" is an integrated tool combining In-Tray Scanning & Taping functions into a single platform. It also features up to 6 semiconductor back-end processes into a compact system. This leadership product not only provides the highest throughput for tray & taping output, its comprehensive Package Visual Inspection capabilities ensure that outgoing quality specifications are never compromised.

Adopting STI’s proprietary 3D “On-the-Fly” Laser and 2D Camera technologies in tandem allows for inspection to be carried out with devices in “live-bug” orientation. This eliminates the risk of device dropping during tray-flip for “dead-bug” presentation required in conventional machines. The dual taper design maximises machine utilisation as production is uninterrupted during material changeover.
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Blk 25 Kallang Avenue #04-01 Kallang Basin Industrial Estate Singapore 339416T (65) 6394 5678F (65) 6392 6933Company Registration No.: 199703264G
 
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