iSort – Wafer-Level Die Sorting System

The iSort revolutionise die sorting systems by being the first to offer 3D bump, Package Visual Inspection and Active Die Inspection integrated into a compact die sorting platform. These added features combine to provide a streamlined and efficient process flow. It not only enhances quality assurance, but also offers the lowest cost of ownership. This intelligent system sorts dies into tape & reel with precision and high speed. Devices can also be placed onto Standard Jedec trays or waffle paks.

Wafer inspection tool or die sorting system? The decision is yours… but you won’t go wrong either way.