In our semiconductor equipment division, we focus on providing you solutions for the backend processes of laser marking, mark and lead/ ball inspection, lead conditioning, reject management and tape & reel.

Integrating our proprietary laser-based vision technology, our equipment performs additional value-added processes such as pre-mark orientation check and post-mark quality inspection.

In line with the fast changing needs of the semiconductor industry, we constantly innovate to bring you better products and services. Our "Integra" series integrate up to 10 backend processes onto a single platform allowing you greater flexibility, reduction in manual material handling and providing significant floor-space savings.

We have also entered the new emerging market for wafer-level packaging and also auto die sensors, which offers a complete quality package inspection known good and wafer level CSP.

Please click the following for more details on our products: